Description
The DWL 2000 GS and DWL 4000 GS are industry-leading grayscale laser lithography systems, purpose-built for high-resolution, high-throughput 2.5D pattern generation. Designed for mask and wafer-level lithography, these systems excel in producing complex grayscale microstructures used in MEMS, ICs, micro-optics, microfluidics, holography, and security printing.
Engineered with a professional grayscale mode supporting up to 1023 gray levels, and a write area of up to 400 x 400 mm², these tools are perfect for wafer-level optics for telecommunications and display manufacturing. The integrated GenISys BEAMER software allows for 3D shape optimization, offering optical-quality surfaces with roughness as low as 5 nm.
Key Features & Benefits:
1023 Gray Level Exposure for 2.5D Structures
- Enables creation of complex topographies for micro-lens arrays, holograms, reflectors, and more
- Supports DXF, BMP, STL, X,Y,Z-ASCII file formats
High-Speed & High-Resolution Exposure
- Minimum 500 nm feature size
- Up to 1000 mm²/min grayscale write speed (DWL 4000 GS, Mode V)
Superior Exposure Quality
- Edge roughness: 40 nm
- CD uniformity: 60 nm
- Alignment accuracy: 60 nm
- 2nd layer alignment: 250 nm
Stable ISO 4 Cleanroom Environment
- Integrated temperature-controlled flow box with ±0.1°C stability
Precision Autofocus System
- Real-time optical or air-gauge autofocus
- Compensation range up to 80 µm
Optimized for Micro-Optics & Industrial Production
- Used for wafer-level optics, microfluidics, and high-end holography
- Adopted by multinational corporations in telecom and illumination
Why Choose DWL 2000 GS / DWL 4000 GS?
- Professional grayscale output with minimal surface roughness
- Robust industrial design with air-bearing stage, fixed optics & real-time monitoring
- Built-in cameras for alignment to existing features
- Powerful layout optimization via GenISys BEAMER software
- ISO 4-compatible chamber ensures process reliability
- Scalable with automation-ready features for high-volume production
Available Modules & System Options:
Write Modes:
- Mode I to V, offering balance between speed and resolution (up to 870 mm²/min for DWL 2000 GS, 1000 mm²/min for DWL 4000 GS)
- Grayscale & binary lithography supported
Exposure Wavelength:
- 405 nm diode laser
Autofocus Options:
- Air-gauge or optical with 80 µm compensation range
GenISys BEAMER Software:
- Advanced 3D proximity effect correction (3D-PEC) and exposure simulation
Automation Add-ons:
- Substrate loading unit
- Additional carrier station
- Pre-aligner and scanner
System Specifications Summary:
| Feature | DWL 2000 GS | DWL 4000 GS |
|---|---|---|
| Max Exposure Area | 200 x 200 mm² | 400 x 400 mm² |
| Write Speeds (Grayscale) | Up to 870 mm²/min | Up to 1000 mm²/min |
| Write Speeds (Binary) | Up to 870 mm²/min | Up to 1000 mm²/min |
| Grayscale Levels | Up to 1023 | Up to 1023 |
| Autofocus | Optical or Air-gauge | Optical or Air-gauge |
| Environment | ISO 4, ±0.1°C stability | ISO 4, ±0.1°C stability |
| Minimum Feature Size | 0.5 µm | 0.5 µm |
| CD Uniformity / Edge Roughness | 60 nm / 40 nm | 60 nm / 40 nm |
| 2nd Layer Alignment | 250 nm | 250 nm |
| System Dimensions | 2350x1650x2100 mm, 3000 kg | Same |
| Electrical Input | 400V ± 5%, 16A | Same |
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FAQs (Frequently Asked Questions):
Who uses the DWL 2000 GS / 4000 GS systems?
Semiconductor fabs, telecoms, optical labs, and microfluidic developers use it for high-precision 2.5D lithography.
What grayscale applications are supported?
Microlenses, Fresnel lenses, holograms, blazed gratings, reflectors, fluidic channels, and more.
How is the grayscale quality controlled?
Exposure intensity is mapped pixel-by-pixel from 3D CAD input to ensure accurate height control.
Is the system suitable for large-scale industrial production?
Yes! With high write speeds, large exposure areas, and automation options, it’s ideal for volume manufacturing.
What automation options are available?
Substrate loading, pre-alignment, and scanning modules support seamless high-throughput operation.
