Glow Discharge Optical Emission Spectrometry

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    • Ultra-Fast Depth Profiling – Achieves nanometric depth resolution with High Dynamic Detection (HDD), enabling depth profiling from the first nanometer down to 150 microns.
    • Simultaneous Multi-Element Analysis – Full spectral coverage from 110 to 800 nm for simultaneous detection of H, O, C, N, Cl, and other elements.
    • Patented Differential Interferometry Profiling (DiP) – Real-time crater depth and erosion rate measurement, providing accurate depth profiling with nanometric precision.
    • RF and Pulsed RF Operation – Pulsed RF source allows higher instantaneous power without damaging fragile or heat-sensitive samples.
    • High Sensitivity & Dynamic Range – High Dynamic Detectors (HDD) ensure superior sensitivity from sub-ppm to 100% concentration, eliminating matrix effects.
    • Advanced UFS Mode – Ultra-Fast Sputtering Mode for polymeric and organic materials without damage, speeding up surface analysis.
    • Wide Range of Applications – Ideal for thin films, multilayer coatings, semiconductors, photovoltaics, metallurgy, ceramics, and corrosion studies.
    • Intuitive Quantum Software – Powerful data processing suite with Intelligent Quantification Models, real-time measurement display, and customizable reporting tools.
    • Flexible Sample Handling – Large sample compartment accommodates odd-shaped samples with various anode diameters and accessories for complex samples.
    • No Ultra-High Vacuum Required – Operates under low pressure plasma, reducing maintenance and operational costs.

     


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