High-speed direct-write lithography for semiconductor packaging

High-Speed Maskless Lithography for Industrial Volume Production

• High-Throughput Industrial Production: Supports wafers up to 300 x 300 mm² with sub-micron precision.
• 1.5 µm Minimum Feature Size: Offers high resolution and uniformity for demanding applications.
• Dynamic Autofocus & Distortion Correction: Ensures perfect patterning even on warped or corrugated substrates.
• Full Automation & MES Integration: Seamless connection with SECS/GEM and OPC-UA protocols.
•  Flexible Write Modes:
  • Standard Write Mode: 1.5 µm resolution for fine-feature lithography.
  • High-Throughput Mode: 3 µm resolution for faster exposure and mass production.
• Eliminates Mask-Related Costs: Faster turnaround time and higher design flexibility.