Maskless Direct Imaging System

High-Resolution Maskless Direct Imager for R&D & Prototyping

• Maskless Direct Imaging: Write high-resolution microstructures in i-line resists without requiring photomasks.
• Ultra-High-Speed Exposure: 100 x 100 mm² exposure in just 9 minutes.
• Exceptional Resolution & Accuracy:
  • Minimum feature size: 500 nm
  • Edge roughness: < 40 nm
  • CD uniformity: < 60 nm
  • Alignment accuracy: Topside: 100 nm | Backside VIS/IR: ±1 µm
• Advanced Calibration & Autofocus:
  • Real-time optical & pneumatic autofocus with 80 µm dynamic compensation.
  • Integrated metrology functions for positioning, CD uniformity, and edge roughness monitoring.
• Multi-Mode Write System: Choose from two write modes:
  • High NA Mode: Maximum resolution for ultra-fine microstructures.
  • Lower NA Mode: Optimized for throughput and depth-of-focus (DOF) critical applications.
• Scalable & Flexible:
  • Maximum exposure area: 300 x 300 mm².
  • Compatible with wafers up to 300 mm in size.