Micro-Optics Fabrication

High-Speed Maskless Lithography for R&D & Rapid Prototyping

• Fastest Maskless Lithography System: 150 mm wafer exposed in under 16 minutes.
• High-Resolution Patterning:
  • Edge roughness: 60 nm
  • CD uniformity: 100 nm
  • 40 nm address grid
• Flexible Write Modes:
  • High-Resolution Mode: 500 nm lines & spaces (375 nm wavelength).
  • High-Aspect Ratio Mode: Up to 1:20 aspect ratio, ideal for microfluidics and MEMS
• Scalable & Modular:
  • Exposure area upgradable from 150 x 150 mm² to 200 x 200 mm².
  • Substrate sizes range from 3” to 6” (up to 8” on request).
• Energy-Efficient & Long-Lasting:
  • Solid-state laser light sources with 10-20 year lifespan.
  • Low operational and maintenance costs.
• Seamless Integration in Multi-User Facilities:
  • Less than 1-hour training required for full user qualification.
  • Automatic front & backside alignment with real-time autofocus.