EMIA-Step Carbon/Sulfur Analyzer

With the use of the Eyecon2 – Direct Imaging Particle Analyzer, clients may better comprehend particle size and shape variation, which allows them to ascertain why a process is failing, why yield is decreasing, the cause of product variation, and if or how a process should be scaled up for commercial manufacture.

Eyecon2 has reduced cycle time and increased yields due to its use of Fluidised Bed Coating (e.g. Wurster), fluidised bed Granulation/Drying, Twin Screw Granulation, Dry Granamination/Roller Compaction, Extrusion Spheronisation, Milling, Blending, and product transfer process equipment. It uses direct imaging processed in real-time, with ellipses fitted to each particle’s boundary, shape and size reported back, highlighting variations. Continuous monitoring of processes critical quality attributes (CQAs) can be used to devise a data-driven control strategy, and non-product contact is used to ensure proper measurements every time.

• The Partica CENTRIFUGE CN-300 is a high-resolution particle size distribution analyzer that uses centrifugation.
• It has a measurement range of 10 nm – 40 μm and applies the centrifugal force of up to 30,000g.
• Temperature control is used to ensure accurate measurement results for various samples.
• It offers precision measurement for both undiluted and dilute samples.
• The centrifugation technique allows for capturing small amounts of foreign particles and agglomerations.
• The instrument maintains stable measurement over long periods by preventing temperature increases in the sample.
• It is designed for robust and easy use, with a simple cell setup and easy cleaning and replacement of the cuvette-type cell.

• High Accuracy – Accurate detection with 1.6 ppm carbon and 2 ppm sulfur sensitivity.
• Proven NDIR Technology – Ensures reliable gas detection with non-dispersive infrared sensors.
• Shortened Cycle Time – Speeds up the development and manufacturing process.
• Flexible Upgrades – Modular design allows users to expand functionality post-installation.
• User-Friendly Interface – Intuitive software with One-Click Operation Mode for efficient workflow.
• Enhanced Cleaning Efficiency – Reduced maintenance cycle, supporting up to 200 measurements without furnace cleaning.
• Versatile Applications – Suitable for analyzing metals, ceramics, semiconductors, minerals, batteries, catalysts, and more.
  • Optional Advanced Accessories:
    • Purifier Unit – Removes hydrocarbon impurities in carrier gas for ultra-low carbon concentration measurement.
    • Auto Sampler Unit – Holds up to 20 positions for continuous automated analysis.
    • Halogen Trap Unit – Eliminates halogen elements to prevent equipment corrosion.

• Ultra-Fast Depth Profiling – Achieves nanometric depth resolution with High Dynamic Detection (HDD), enabling depth profiling from the first nanometer down to 150 microns.
• Simultaneous Multi-Element Analysis – Full spectral coverage from 110 to 800 nm for simultaneous detection of H, O, C, N, Cl, and other elements.
• Patented Differential Interferometry Profiling (DiP) – Real-time crater depth and erosion rate measurement, providing accurate depth profiling with nanometric precision.
• RF and Pulsed RF Operation – Pulsed RF source allows higher instantaneous power without damaging fragile or heat-sensitive samples.
• High Sensitivity & Dynamic Range – High Dynamic Detectors (HDD) ensure superior sensitivity from sub-ppm to 100% concentration, eliminating matrix effects.
• Advanced UFS Mode – Ultra-Fast Sputtering Mode for polymeric and organic materials without damage, speeding up surface analysis.
• Wide Range of Applications – Ideal for thin films, multilayer coatings, semiconductors, photovoltaics, metallurgy, ceramics, and corrosion studies.
• Intuitive Quantum Software – Powerful data processing suite with Intelligent Quantification Models, real-time measurement display, and customizable reporting tools.
• Flexible Sample Handling – Large sample compartment accommodates odd-shaped samples with various anode diameters and accessories for complex samples.
• No Ultra-High Vacuum Required – Operates under low pressure plasma, reducing maintenance and operational costs.