Heidelberg DWL 66+ High-Resolution Laser Lithography

Heidelberg DWL 66+ High-Resolution Laser Lithography

Ultimate Laser Lithography Tool for Research & Prototyping

  • High-Resolution Patterning: Minimum feature size down to 300 nm, outperforming traditional optical lithography.
  • Grayscale Lithography: Supports up to 1024 gray levels for 2.5D topographies (e.g., diffractive optics, micro-optics, holograms).
  • Precision Alignment:
    • Frontside Alignment Accuracy: 250 nm
    • Backside Alignment Accuracy (Optional): 1000 nm
    • 2nd Layer Overlay Accuracy: 350 nm (with High-Accuracy Option)
  • Versatile Substrate Compatibility: Supports substrates from 5 mm to 230 mm, with thickness up to 12 mm.
  • Flexible Laser Options: Choose between 405 nm (broadband resists) and 375 nm (SU-8 & i-line resists).
  • Automated Loading System (Optional): Enables high-precision wafer handling, supporting masks up to 7” and wafers up to 8”.

 




Description

The DWL 66+ is a high-resolution direct-write laser lithography system designed for cutting-edge research, rapid prototyping, and mask-making applications. This versatile tool is ideal for microelectronics, MEMS, microfluidics, sensors, advanced packaging, and materials science.

With six configurable write modes, a choice of laser wavelengths (375 nm & 405 nm), and an extensive selection of modules, the DWL 66+ ensures unmatched precision, speed, and flexibility. It features grayscale lithography, enabling 2.5D microstructure fabrication for optical elements, holograms, and micro-optics.

Why Choose DWL 66+ High-Resolution Laser Lithography?

  • Ultimate Versatility: Ideal for MEMS, photonics, semiconductor research, and microfabrication applications.
  • Industry-Leading Resolution: 300 nm minimum feature size with 60 nm CD uniformity.
  • Maskless, Direct-Write Lithography: Reduces turnaround time & eliminates mask-related costs.
  • Advanced 2.5D Lithography Capabilities: Grayscale exposure for micro-optics and diffractive structures.
  • Customizable & Scalable: Upgradable write modes, automation options, and substrate handling flexibility.
  • Automated Workflow for Efficiency: Pre-aligners, wafer scanners, and automated mask handling for streamlined processing.

 

Click here to view more products from Heildelberg Instruments.


FAQs (Frequently Asked Questions):

What applications is the DWL 66+ best suited for?
The DWL 66+ is optimized for nanofabrication, MEMS, microfluidics, photonics, and semiconductor research.

What is the smallest feature size the DWL 66+ can pattern?
The system achieves minimum feature sizes of 300 nm in High-Resolution Mode.

How does grayscale lithography work on the DWL 66+?
It allows 2.5D structuring by exposing gradual intensity variations, creating topographies for micro-optics and holograms.

What are the main advantages of direct-write lithography?
No photomasks required, reducing costs, production time, and enabling rapid design iterations.

How does the automatic loading system improve efficiency?
It streamlines mask & wafer handling, reducing manual errors and improving throughput.

What are the benefits of the High-Accuracy Coordinate System?
Improves thermal stability, positioning accuracy, and 2nd layer alignment down to 350 nm.

Download Data Sheet