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Heidelberg Instruments NanoFrazor Explore
Datasheet
Heidelberg Instruments NanoFrazor Explore
Revolutionizing Nanofabrication
Introducing the Heidelberg Instruments NanoFrazor Explore
NanoFrazor Explore is the first commercial thermal scanning probe lithography tool. NanoFrazor Explore is used for nanopatterning of quantum devices on 1D/2D materials, such as quantum dots, Dolan bridges and Josephson junctions, and nanoscale arrays. Its unique capabilities enable new devices in new materials. For example, it is used for advanced applications such as grayscale photonics devices, nanofluidics structures or biomimetic substrates for cell growth; local modification of materials by heat, e.g. chemical reactions and physical phase changes.
The technology behind the system is the result of more than 20 years of intensive research and development (R&D) that started at IBM Research Zürich, and now happens at Heidelberg Instruments Nano. The NanoFrazor hardware and software are constantly advancing to extend the capabilities and performance of the tool and its range of applications. Our dedicated team of experts keeps developing and optimizing the pattern transfer processes for different applications. We compile this know-how in a growing collection of best practices and protocols to support our customers.
Key Features
High-resolution
Easy patterning of nanostructures even with complex geometries; min. lateral features 15 nm, Vertical resolution 2 nm
Thermal Scanning Probe Lithography
New approach to nanopatterning enabling applications not otherwise feasible
Non-invasive Lithography
No damage from charged particles, no proximity effects, clean lift-off
Compatibility
With all standard pattern transfer methods: lift-off, etching, etc – knowledge resource and best practices available in our “Recipe Book”
In-situ Imaging
Immediate control of patterned structures
Precise Overlay and Stitching
Markerless overlay and stitching accuracy 25 nm specified, sub-10 nm overlay shown
Unique Thermal Cantilevers
Integrated microheater and distance sensor; easy to exchange and economica
Laser Sublimation Module
High-throughput exposure of coarse structures in the same exposure step; 405 nm wavelength CW fiber laser
Compact
1.85 m x 0.78 m x 1.28 m
Vibration Isolation
Three-layer acoustic and superior vibration isolation (> 98% @ 10 Hz)
Low Cost of Ownership
No need for cleanroom, vacuum pump or expensive consumables
Key Benefits
With the direct laser sublimation module, nano- and microstructures are now seamlessly and quickly written into the same resist layer in a single fabrication step. In-situ imaging enables two unique features: markerless overlay, and comparison of the written and target patterns during writing, so the parameters can be immediately adjusted. This approach, called closed-loop lithography, results in sub-2 nm vertical precision for 2.5D (grayscale) shapes of any complexity. Fast and precise control of a heated nanoscale tip enables innovation not otherwise feasible.
Grayscale Software Module
3D patterning at <2 nm vertical resolution
Decapede Module
10-tip write head for 10-fold increase in throughput fo high-resolution patterning
Glovebox Integration
Customized solution in collaboration with MBraun ensures minimized vibrations for work in controlled environments
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Specifications
| Thermal Probe Writing | Direct Laser Sublimation | |
|---|---|---|
| Writing performance | ||
| Minimum structure size [nm] | 15 | 600 |
| Minimum lines and spaces [half pitch, nm] | 25 | 1000 |
| Grayscale / 3D-resolution (step size in PPA) [nm] | 2 | – |
| Writing field size [X μm x Y μm] | 60 x 60 | 60 x 60 |
| Field stitching accuracy (markerless, using in-situ AFM imaging) [nm] | 25 | 300 |
| Overlay accuracy (markerless, using in-situ AFM imaging) [nm] | 25 | 100 |
| Write speed (typical scan speed) [mm/s] | 1 | 5 |
| Write speed (thermal Probe: 50 nm pixel, incl. imaging) [μm²/min] | 1000 | 100 000 |
| AFM imaging performance | ||
| Lateral imaging resolution (feature size) [nm] | 10 | 10 |
| Vertical resolution (topography sensitivity) [nm] | 0.2 | 0.2 |
| Imaging speed (50 nm pixel) [μm²/min] | 1000 | 1000 |
| System features | |
|---|---|
| Substrate sizes | 1 x 1 mm² to 100 x 100 mm², 0 – 20 mm thickness (150 x 150 mm² possible with limitations) |
| Optical microscope | 0.6 μm optical resolution, 1.0 mm x 1.0 mm field of view, autofocus |
| Laser source and optics | 405 nm wavelength CW fiber laser, up to 150 mW output power on sample, 1.2 µm minimum focal spot size |
| Real-time laser autofocus | Using the distance sensor of the NanoFrazor cantilever |
| Magnetic cantilever holder | Fast (< 1 min) and accurate tip exchange |
| Housing | Three-layer acoustic isolation, superior vibration isolation (> 98% @ 10 Hz) PC-controlled temperature and humidity monitoring, gas-flow regulation |
| Software features | GDS and bitmap import, 0.1 nm address grid, 256 grayscale levels, AFM image analysis and drawing for overlay, mix & match between tip and laser writing, fully automated calibration routines, Python scripting |
| NanoFrazor cantilever features | |
| Integrated components | Tip heater, topography sensor, electrostatic actuation |
| Tip geometry | Conical tip with < 10 nm radius and 750 nm length |
| Tip heater temperature range | 25 °C – 1100 °C (< 1 K setpoint resolution) |
| System dimensions & installation requirements | |
| Height × width × depth | 185 cm x 78 cm x 128 cm |
| Weight | 650 kg |
| Power input | 1 x 110 or 220 V AC, 10 A |
| Gas input | Compressed air and/or nitrogen with > 4 bar |
| Other considerations | |
| Recipe book with detailed descriptions of various processes is included (regularly updated with software) | |
| Cantilever tips degrade over time (> 50 h patterning possible). Exchange is fast and low cost for tool owners. | |
| A clean room or special laboratory is not required. No vacuum needed. | |
| Multi-tip extension (optional add-on for Explore system) is scheduled for beta site testing in mid-2020. |
