Mini E-Beam Evaporator

Mini E-Beam Evaporator

Precision Thin-Film Deposition with Low Thermal Load and Multi-Material Co-Evaporation

  • Contact Metallization in Microelectronics
  • Lift-Off Processes in Nanofabrication
  • Thin-Film Deposition of High-Purity Metals
  • Research & Development in Surface Science
  • UHV Coating Systems for Sensors, MEMS, and Semiconductors

 




Description

Achieve exceptional precision in thin-film coating applications with the Mini E-Beam Evaporator – EVAP Series by Nikalyte. Designed for research labs and production facilities, this compact UHV-compatible evaporator uses a finely controlled electron beam to directly heat crucibles, enabling efficient deposition of high-purity metals such as Gold, Silver, and Chrome.

Available in three configurations—Single Pocket (EVAP-1), Compact 4-Pocket (EVAP-4C), and High-Capacity 4-Pocket (EVAP-4)—this system enables co-evaporation of up to 4 materials, making it ideal for lift-off processes, contact metallization, and precise nanofabrication on heat-sensitive substrates.

By utilizing partial beam collimation and flux monitoring, the EVAP series ensures superior material utilization and reduced thermal impact, offering a major advantage over traditional e-beam hearth or thermal boat evaporators.

Features of Mini E-Beam Evaporators:

High-Precision Metal Deposition

  • Direct electron beam heating of crucibles or rods
  • Ideal for Au, Ag, Cr, and other metals
  • Controlled evaporation with minimal substrate heating

Multi-Pocket Co-Evaporation

  • EVAP-4 and EVAP-4C models support simultaneous 4-material evaporation
  • Manual or pneumatic independent shutter control

Compact & UHV Compatible

  • Mounts via NW40CF or NW63CF flange
  • Bakeable up to 250°C
  • Fully UHV compatible with minimal outgassing

Advanced Flux Monitoring

  • Built-in ion flux plate measures deposition rate in real time
  • Flux regulation, filament, and power control via combined 4-channel controller

Customizable & Efficient

  • In-vacuum length customizable (standard 300 mm)
  • Cooling flow: minimum 1.0 l/min
  • Active copper cooling reduces heat radiation

Why You Should Buy:

  • Minimizes waste of expensive materials like gold and platinum
  • Compact footprint perfect for limited-space UHV chambers
  • Fast setup and swap with replaceable crucibles and liners
  • Superior for low-temperature thin-film deposition on delicate substrates
  • Scalable for complex coating requirements using multi-pocket co-evaporation

Technical Specifications Summary:

Model EVAP-1 EVAP-4C EVAP-4
Mount Flange NW40CF (2.75″) NW40CF (2.75″) NW63CF (4.5″)
No. of Pockets 1 4 4
Co-Evaporation No Yes Yes
Crucible Sizes 210, 390, 1000 mm³ 210, 390 mm³ 210, 390, 1000 mm³
Crucible Materials Mo, VC, W Mo, VC, W Mo, VC, W
Crucible Liners PBN, Al₂O₃ PBN, Al₂O₃ PBN, Al₂O₃
Bakeable Temp Up to 250°C Up to 250°C Up to 250°C
Flux Monitoring Yes Yes Yes
Shutter Control Manual/Pneumatic Manual/Pneumatic Manual/Pneumatic
Power Supply Combined 4-channel Combined 4-channel Combined 4-channel
In-vacuum Length 300 mm (customizable) 300 mm (customizable) 300 mm (customizable)

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FAQs (Frequently Asked Questions):

Q: Can the EVAP system be integrated into an existing UHV system?
A: Yes! The EVAP series is fully UHV-compatible and can be integrated with custom or commercial vacuum chambers.

Q: What’s the thermal impact on substrates?
A: The evaporator is designed to have minimal heat load due to efficient heat absorption and active cooling, making it ideal for sensitive substrates.

Q: Is it possible to monitor deposition rates in real time?
A: Absolutely. Each unit comes with flux monitoring via ion flux plates, ensuring precise rate control.

Q: What materials are supported?
A: Common process metals like Gold (Au), Silver (Ag), Chrome (Cr) and more using crucible or rod feedstock.

Q: How is co-evaporation managed?
A: The EVAP-4 and 4C models include 4 independent crucible pockets, each controllable via the included 4-channel power supply.

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