Technologies

• High Accuracy & Repeatability – Measures hydrogen concentrations up to 0.02% with precision SD ≤ 0.04 μg/g.
• Advanced TCD Design – Utilizes optimized Thermal Conductivity Detector for reliable and consistent measurements.
• Wide Measurement Range – Covers ppm to percentage levels, suitable for low and high hydrogen content.
• User-Friendly Software – Intuitive interface with real-time signal display, automatic data saving, and easy data management.
• Maintenance Navigator – Built-in maintenance counter and step-by-step guidance for consumable replacement, ensuring consistent accuracy and minimal downtime.
• High Throughput & Efficiency – Completes one measurement cycle in just 70 seconds, enabling up to 50 samples per hour.
• Comprehensive Security & Compliance – Complies with JIS Z2614, JIS H1619, JIS H1664, JIS H0696, and ASTM E1447 standards, ensuring accurate and standardized measurements.
• Versatile Applications – Suitable for titanium, zirconium, tantalum, iron, copper, nickel, aluminum, semiconductors, ceramics, catalysts, and other advanced materials.

• Fast & Efficient Analysis – Reduces analysis cycle time by 40%, enabling high-throughput measurements.
• High Accuracy & Precision – In-house developed NDIR and TCD detectors ensure stable and reliable measurements.
• Cost-Efficiency – Reduces carrier gas consumption by approximately 40%, increasing the number of measurements per gas cylinder.
• Advanced Cleaning Efficiency – New dust filter mechanism reduces the need for frequent maintenance by 10 times, ensuring continuous operation.
• Enhanced User Safety – Automated crucible loader, auto sampler, and auto cleaner reduce manual handling and operator exposure.
• Superior Versatility – Analyzes a wide range of materials, including steel, non-ferrous alloys, ceramics, semiconductors, and energy materials.
• Comprehensive Software & Usability – Intuitive operating software with self-diagnostic monitoring, advanced troubleshooting navigation, and real-time status alerts.
• User-Friendly Interface – Touch-panel, keyboard, and mouse controls for easy operation and navigation.

Flexible Automation Options:

• Crucible Loader – Automatically positions up to 100 crucibles for continuous operation.
• Auto Sampler – Accommodates up to 22 sample positions for automated flux and sample loading.
• Auto Cleaner – Rotating brushes clean the upper and lower electrodes after each measurement for consistent accuracy.

• Fast & Efficient Analysis – Achieves 40% faster analysis cycle time with HORIBA’s proprietary sequence algorithm, enabling high-throughput measurements.
• High Accuracy & Precision – Utilizes in-house developed NDIR and TCD detectors for stable and reliable measurements.
• Cost-Effective Solution – Provides high cost-performance with lower operational costs compared to advanced models.
• Reduced Gas Consumption – 40% reduction in carrier gas consumption, increasing the number of measurements per gas cylinder.
• Easy Maintenance – New dust filter mechanism and easy lower electrode replacement reduce maintenance frequency by 10 times, ensuring continuous operation.
• Versatile Applications – Suitable for energy materials, semiconductors, metallurgy, ceramics, chemicals, and more.
• User-Friendly Interface – Intuitive operating software with self-diagnostic monitoring, advanced troubleshooting navigation, and real-time status alerts.

Flexible Automation Options:

• Crucible Loader – Automatically positions up to 100 crucibles for continuous operation.
• Auto Sampler – Accommodates up to 22 sample positions for automated flux and sample loading.
• Auto Cleaner – Rotating brushes clean the upper and lower electrodes after each measurement for consistent accuracy.

• Superior Accuracy: High-precision measurements with 0.6 ppm detection limit.
• Proven NDIR Technology: Reliable Non-Dispersive Infrared (NDIR) gas detection.
• Advanced Cleaning Efficiency: Patented design reduces furnace cleaning frequency by half, supporting up to 200 measurements without maintenance.
• User-Friendly Interface: Intuitive software with One-Click Operation Mode for streamlined workflow.
• Touch-Panel Operation: Optional touch-screen interface for easy navigation and control.
• Enhanced Reliability: Automatic Diagnosis System ensures consistent performance and preventive maintenance.
• Versatile Applications: Suitable for analyzing metals, ceramics, semiconductors, minerals, batteries, catalysts, and more.
• Wide Measurement Range: Ideal for inorganic materials including steel, non-ferrous alloys, rare metals, cokes, and carbon black.
• Robust Design: Made in Japan with high durability and low maintenance requirements.
• Advanced Accessories: Includes crucible pre-heating unit, heating filter unit, and carrier gas purifier for superior analytical performance.

• High Accuracy – Accurate detection with 1.6 ppm carbon and 2 ppm sulfur sensitivity.
• Proven NDIR Technology – Ensures reliable gas detection with non-dispersive infrared sensors.
• Shortened Cycle Time – Speeds up the development and manufacturing process.
• Flexible Upgrades – Modular design allows users to expand functionality post-installation.
• User-Friendly Interface – Intuitive software with One-Click Operation Mode for efficient workflow.
• Enhanced Cleaning Efficiency – Reduced maintenance cycle, supporting up to 200 measurements without furnace cleaning.
• Versatile Applications – Suitable for analyzing metals, ceramics, semiconductors, minerals, batteries, catalysts, and more.
  • Optional Advanced Accessories:
    • Purifier Unit – Removes hydrocarbon impurities in carrier gas for ultra-low carbon concentration measurement.
    • Auto Sampler Unit – Holds up to 20 positions for continuous automated analysis.
    • Halogen Trap Unit – Eliminates halogen elements to prevent equipment corrosion.

• Precision Temperature Control – Variable heating range from 300°C to 1450°C with excellent temperature stability, supporting both low-temperature and high-temperature combustion analysis.
• Proven NDIR Technology – Ensures accurate gas detection with non-dispersive infrared sensors.
• Advanced Gas Collection Mode – Efficient combustion under high-pressure oxygen for precise analysis of high melting point materials.
• New Dust-Filter Mechanism – Collects dust from high-temperature combustion, preventing gas adsorption and ensuring highly sensitive analysis.
• High Throughput – Completes one measurement cycle in just 70 seconds, enabling analysis of up to 50 samples per hour.
• Versatile Applications – Suitable for steel, cokes, catalysts, non-ferrous alloys, lithium-ion battery materials, ceramics, minerals, chemicals, and electronic components.
• Enhanced Software & Usability – Intuitive software with self-diagnostic monitoring, troubleshooting navigation, and advanced operator assistance.
• User-Friendly Interface – Includes touch-panel, keyboard, and mouse control for efficient operation.
• Compliance with Global Standards – Certified to ASTM, ISO, and other international standards for accurate and reliable carbon/sulfur analysis.

• Ultra-Fast Depth Profiling – Achieves nanometric depth resolution with High Dynamic Detection (HDD), enabling depth profiling from the first nanometer down to 150 microns.
• Simultaneous Multi-Element Analysis – Full spectral coverage from 110 to 800 nm for simultaneous detection of H, O, C, N, Cl, and other elements.
• Patented Differential Interferometry Profiling (DiP) – Real-time crater depth and erosion rate measurement, providing accurate depth profiling with nanometric precision.
• RF and Pulsed RF Operation – Pulsed RF source allows higher instantaneous power without damaging fragile or heat-sensitive samples.
• High Sensitivity & Dynamic Range – High Dynamic Detectors (HDD) ensure superior sensitivity from sub-ppm to 100% concentration, eliminating matrix effects.
• Advanced UFS Mode – Ultra-Fast Sputtering Mode for polymeric and organic materials without damage, speeding up surface analysis.
• Wide Range of Applications – Ideal for thin films, multilayer coatings, semiconductors, photovoltaics, metallurgy, ceramics, and corrosion studies.
• Intuitive Quantum Software – Powerful data processing suite with Intelligent Quantification Models, real-time measurement display, and customizable reporting tools.
• Flexible Sample Handling – Large sample compartment accommodates odd-shaped samples with various anode diameters and accessories for complex samples.
• No Ultra-High Vacuum Required – Operates under low pressure plasma, reducing maintenance and operational costs.

High-Precision Grayscale Lithography Systems for Micro-Optics & More

• Minimum Feature Size: 500 nm
• Write Modes: Five options with variable write speeds and resolutions
• Max Substrate Size: DWL 2000 GS: 200 x 200 mm², DWL 4000 GS: 400 x 400 mm²
• Exposure Speed: Up to 1000 mm²/min in grayscale mode
• Automation Ready: Loading system, carrier station, pre-aligner & scanner options available

Ultimate Laser Lithography Tool for Research & Prototyping

• High-Resolution Patterning: Minimum feature size down to 300 nm, outperforming traditional optical lithography.
• Grayscale Lithography: Supports up to 1024 gray levels for 2.5D topographies (e.g., diffractive optics, micro-optics, holograms).
• Precision Alignment:
  • Frontside Alignment Accuracy: 250 nm
  • Backside Alignment Accuracy (Optional): 1000 nm
  • 2nd Layer Overlay Accuracy: 350 nm (with High-Accuracy Option)
• Versatile Substrate Compatibility: Supports substrates from 5 mm to 230 mm, with thickness up to 12 mm.
• Flexible Laser Options: Choose between 405 nm (broadband resists) and 375 nm (SU-8 & i-line resists).
• Automated Loading System (Optional): Enables high-precision wafer handling, supporting masks up to 7” and wafers up to 8”.

High-Speed Maskless Lithography for R&D & Rapid Prototyping

• Fastest Maskless Lithography System: 150 mm wafer exposed in under 16 minutes.
• High-Resolution Patterning:
  • Edge roughness: 60 nm
  • CD uniformity: 100 nm
  • 40 nm address grid
• Flexible Write Modes:
  • High-Resolution Mode: 500 nm lines & spaces (375 nm wavelength).
  • High-Aspect Ratio Mode: Up to 1:20 aspect ratio, ideal for microfluidics and MEMS
• Scalable & Modular:
  • Exposure area upgradable from 150 x 150 mm² to 200 x 200 mm².
  • Substrate sizes range from 3” to 6” (up to 8” on request).
• Energy-Efficient & Long-Lasting:
  • Solid-state laser light sources with 10-20 year lifespan.
  • Low operational and maintenance costs.
• Seamless Integration in Multi-User Facilities:
  • Less than 1-hour training required for full user qualification.
  • Automatic front & backside alignment with real-time autofocus.

High-Speed Maskless Lithography for Industrial Volume Production

• High-Throughput Industrial Production: Supports wafers up to 300 x 300 mm² with sub-micron precision.
• 1.5 µm Minimum Feature Size: Offers high resolution and uniformity for demanding applications.
• Dynamic Autofocus & Distortion Correction: Ensures perfect patterning even on warped or corrugated substrates.
• Full Automation & MES Integration: Seamless connection with SECS/GEM and OPC-UA protocols.
•  Flexible Write Modes:
  • Standard Write Mode: 1.5 µm resolution for fine-feature lithography.
  • High-Throughput Mode: 3 µm resolution for faster exposure and mass production.
• Eliminates Mask-Related Costs: Faster turnaround time and higher design flexibility.

High-Resolution, Modular Nanolithography Tool for Advanced Research

• High-Resolution Nanopatterning: 15 nm lateral features, <2 nm vertical resolution.
• Markerless Overlay & Stitching: 25 nm alignment accuracy without markers.
• Damage-Free Lithography: No charged particles or proximity effects, ensuring clean lift-off and etching compatibility.
• Hybrid t-SPL & DLS Lithography: Fast large-area patterning with laser sublimation (DLS) and high-resolution nanoscale writing with t-SPL.
• Parallel Writing with Decapede Module: 10 cantilevers for increased throughput while maintaining high resolution.
• Automated Workflow & Scripting: Python-based automation, real-time imaging, and closed-loop corrections.
• Versatile Process Compatibility: Works with standard pattern transfer methods, including lift-off, etching, and molding.

High-Resolution Maskless Direct Imager for R&D & Prototyping

• Maskless Direct Imaging: Write high-resolution microstructures in i-line resists without requiring photomasks.
• Ultra-High-Speed Exposure: 100 x 100 mm² exposure in just 9 minutes.
• Exceptional Resolution & Accuracy:
  • Minimum feature size: 500 nm
  • Edge roughness: < 40 nm
  • CD uniformity: < 60 nm
  • Alignment accuracy: Topside: 100 nm | Backside VIS/IR: ±1 µm
• Advanced Calibration & Autofocus:
  • Real-time optical & pneumatic autofocus with 80 µm dynamic compensation.
  • Integrated metrology functions for positioning, CD uniformity, and edge roughness monitoring.
• Multi-Mode Write System: Choose from two write modes:
  • High NA Mode: Maximum resolution for ultra-fine microstructures.
  • Lower NA Mode: Optimized for throughput and depth-of-focus (DOF) critical applications.
• Scalable & Flexible:
  • Maximum exposure area: 300 x 300 mm².
  • Compatible with wafers up to 300 mm in size.

Compact Maskless Lithography System for High-Precision Microstructuring

• High-Resolution Maskless Lithography: No mask required—direct-write exposure ensures efficient and cost-effective fabrication.
• Flexible Exposure Modes:
  • Raster Scan Mode: Consistent high-speed writing regardless of pattern density.
  • Vector Scan Mode: Ideal for curved structures, delivering smooth, continuous lines.
• Compact & Small Footprint: 25″ x 33″ x 21″ (640 mm x 840 mm x 530 mm) – fits on a standard lab workbench.
• Fast Exposure Speeds: A 4″ wafer can be exposed in just 90 minutes.
• Advanced Optical Configurations: Min. resolution of 0.6 µm, 1 µm, and 3 µm, with variable resolution options.
• High-Precision Alignment:
  • Edge roughness: Raster mode: 100 nm, Vector mode: 30 nm
  • CD uniformity: 200 nm
• Upgradable Exposure Area: Expand from 100 x 100 mm² to 150 x 150 mm².
• Glovebox Integration: Compatible for patterning sensitive materials in controlled environments.